Product description
Low residue No-Clean solder paste designed for surface mount and other electronic assembly . The unique properties of this formula provides an excellent activity, long stencil life, long tack time, high print speed and a longer shelf life. Post soldering residues are transparent, non-corrosive and non-conductive.
Embedded Design & Development, Hobby & Education, Industrial,
Solder Alloy: 62, 36, 2 Sn, Pb, Ag
Melting Temperature: 125°C